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	Assembly 　　We provide wide-ranging package types in assembly process. Our on stream services are TSOP, Tape LOC, WSOP, TFBGA, wBGA and μBGA packages. In the trend of small package size and high IO requirements, we are dedicated to speed up the introductions for Tape BGA , Stacked MCP and CSP technology. TSOP wBGA TFBGA Combo(S-MCP) < more... > 　　　　　　　　   The Tessera Compliant Chip Logo is a trademark of Tessera, Inc.   Tessera is a technology partner of PTI.