Used Equipment for Sale

AssemblyDISCO_TOWAINTERCONSBS8808_EAD634020056Saw Singulation The SBS Matrix Array Singulation System is a tapeless fully automatic solution for simulating packages assembled in matrix array strips. The system integrates singulation, wash, dry, and pick-and-place.(Machine in Xian)
AssemblyDNSFC-310020122WET stationTool have 3 chemical bath + 3 quick drain rinse bath + 1 low pressure dry.
AssemblyGPMKS-81220131Die SorterSelect different products to be placed in the specified location(Machine in SUZ) 
AssemblyKLAAIT XUV20121Wafer defect inspectionWafer defect and surface quality inspection tools. 
AssemblyOPTIVIZWIN10020131Mark OutSpray ink on the waste(Machine in SUZ) 
AssemblyOPTIVIZWSM10020131SPIbrush coating quality inspection(Machine in SUZ) 
AssemblyShinkawaSPA-300*3 & SPA-300S *72004 ~ 200710Die bonder The SPA-300 series is an automatic handler developed for the purpose of the mass production and die bonder  
AssemblySHINKAWAUTC-1000S2004~200623Wire bonderWire bonding using interconnections between an integrated circuit (IC) or other semiconductor device and its packaging during semiconductor device fabrication. Although less common, wire bonding can be used to connect an IC to other electronics or to connect from one printed circuit board (PCB) to another. Wire bonding is generally considered the most cost-effective and flexible interconnect technology and is used to assemble the vast majority of semiconductor packages. 
AssemblyTazmoTWS-M311120121Wafer support mounterTemporarily bonding of ultra thin wafer, Unique UV hardening resion is used for the bonding of wafer and supporting material.
AssemblyTSKAWD-300T2005,20072DicingDicing saws use dicing blades to cut silicon with a high degree of accuracy. Fully automatic dicing saws can perform the entire process sequence:loading from the cassette, alignment, dicing, cleaning/drying and unloading to the cassette completely automatically. 
AssemblyYAMAHAI-CubeII20121Cover BondSupport flip chip process(Machine in SUZ) 
Chip ProbingElectro Scientific IndustriesESI 9830 2004/25Laser repair systemThe Model 9830 is based on ESI’s highly successful 98XX platform, which was developed specifically for advanced DRAM, SRAM, embedded memory and other laser fuse applications
Final TestAdvantestM6300200611Automatic handlerThe M6300 is an automatic handler developed for the purpose of the mass production and sort devices (Temprange 125 ~ -55)
Final TestAdvantestM6751AD20054Automatic handlerThe M6751AD is an automatic handler developed for the purpose of the mass production and sort devices
Final TestAdvantestT55852003/105Tester systemT5585 Memory test system,designed for high-volume package production of memorywith high precision testing of up to 128 devices in parallel. Capable of testing 500MHZ double data rate in a single pass.
Final TestANDOAF86522004/8/15BI ovenSimultaneous measurement of 15,552 devices Supports RambusR, DDR-SDRAM, Flash and Embedded Memories. This new test and burn-in system has been proven to be cost effective when testing today’s memory devise. 
Final TestJECJEC_35022006/065BI Oven This burn-in system is designed for the MOS memory and performs variois types of function tests during a burn-in and collects the result.
Final TestProvTTTH140002008/061Tester HandlerThis is Sanwa tester handler, which has a function for tray to tray hanlder, that transfer device to different tray.

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