FBGA


Overview
PTI offers a comprehensive range of IC packages, and FBGA is one of its laminate bases products. With new generation of memory devices, low profile, less power consumption, high density, and time to market, PTI’s FBGA solution can reach all these requirements and even better. PTI focuses on the memory market and strives for technological innovations, achieving thinner wafers, ultra low wire bonding, more chip stacking, in addition to, a "Product Design Center" consisting of an experienced engineering team to achieve perfection in packaging and provide the most compelling solutions for our customers.

Application
PTI’s products have been utilized in a broad application by its end customer, Through PTI’s assembly service and total solutions, clients can completely achieve their need of utilization. Most of products are for portable and consumer application like smart phone, tablet, SSD and so on.

Features
• Package and substrate optimum design
• 4mm to 25mm body sizes are available
• Square or rectangle packages available
• 8 to 492 ball counts
• 0.5 to 1.0mm ball pitch available
• Pb free and Green package available
• Daisy Chain packages available
• Optimum traces for excellent electrical performance
• Low inductance (simulation data)
Reliability
MSL JEDEC Level 2 @ 260℃
JEDEC Level 3 @ 260℃
85℃/ 85% RH, 168hours
Temp/ Humidity 85℃/ 85%, 1000 hours
High Temp Storage 150℃, 1000 hours
HAST 130℃/ 85% RH, 168 hours
Temp Cycle -65/ +150℃, 1000 cycles


  
Home       Contact us      Legal
No.10, Datong Rd., Hsinchu Industrial Park, Hukou, Hsinchu 30352, Taiwan 03-5980300
 Copyright© 2012 Powertech Technology Inc.