TSOP (I/II)

TSOP (I)

TSOP (Thin smaller outline package) is a rectangular surface mount package with outer leads on its short side. The overall thickness is within 1.2mm and is suitable for cellphone and other portable products. PTI offers the TSOP(I) package for various devices, ROM, NOR, NAND Flash.
TSOP (II)

TSOP (Thin smaller outline package) is a rectangular surface mount package with outer leads on its long side. PTI offers the TSOP(II) package for various devices, such as SDRAM, DDR.

Applications
Frequently used for RAM or Flash memory ICs due to their high pin count and small volume.



Features
Substrate Leadframe base
Mold Cap Standard / Green EMC
Die Attach Adhesive Paste/Film tape/DDAF/FOW
Lead-Frame Alloy42/Copper
Lead Pitch 0.18mm
Chip Stacking 2~8 chips stack
Package Stacking 2 package
Wafer Bonding Ultra low loop (35um)
Shipping JEDEC trays/Tape and Reel services
Reliability Level
MSL JEDEC Level L2 @ 260℃ ; 30℃/60% RH, 192hours
PCT 121℃/100% RH, 2atm, 300 hours
TCT - 65℃ to 150℃, 1000 cycles
HAST 130℃/85% RH, 100 hours
High Temp Storage 150℃/ 1000 hours


  
Home       Contact us      Legal
No.10, Datong Rd., Hsinchu Industrial Park, Hukou, Hsinchu 30352, Taiwan 03-5980300
 Copyright© 2012 Powertech Technology Inc.