Package-on-Package/ Package-in-Package (PoP/ PiP)


PoP (Package-on-Package) is designed for space savings, enhanced wafer thinning technology, excellent control on warpage and eliminated die cracks. This package can squeeze the space into applications requiring a thin form factor. PoP was originally applied to Digital Still Camera but was gradually used for intelligent mobile phones. Another popular application of PoP is designed for different functions packages stacking, such as CPU, controller, memory…etc. or just to increase memory density of DRAM modules and Flash memory.

PoP (Package-on-Package) is designed for space savings, enhanced wafer thinning technology, excellent control on warpage and eliminated die cracks. This package can squeeze the space into applications requiring a thin form factor. PoP was originally applied to Digital Still Camera but was gradually used for intelligent mobile phones. Another popular application of PoP is designed for different functions packages stacking, such as CPU, controller, memory…etc. or just to increase memory density of DRAM modules and Flash memory.

Standard Bill of Material
Substrate Thin core BT or equivalent
Alloy or copper LF available
Mold Cap Standard /Green EMC
Die Attach Adhesive Conductive/Non-conductive paste/Film
Gold Wire 17.5/20/23/25/28/30 um available
Solder Ball Lead-free solder
Process Highlight
Chip Stacking 2~4 chips stack
Package Stacking 2 Package Stack
Wafer Grinding 20um for engineering sample
50um for mass production
Wafer Bonding Ultra low loop (35um)
Ball Pitch 0.5~1.0mm
Reliability Level
MSL JEDEC Level L3 @ 260℃
PCT 121℃/100% RH, 96 hours
TCT - 65℃ to 150℃, 1000 cycles
HAST 130℃/85% RH, 96 hours
High Temp Storage 150℃/ 1000 hours
  
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