FCCSP


Overview
PTI offers FCCSP package with low to high I/Os, thin and small profile and lightweight. It enables to stack different type of devices for integration application. FCCSP package provides good protection for chip with underfill and epoxy mold compound. It also could be replace by MUF (mold underfill) material for low cost, simple process flow and short cycle time solution.
Application
• Graphic Memory
• Cellular Phone

Feature
1. Minimum in-line 50um bump pitch (Peripheral)
2. Overmolded for process handling & board level reliability
3. OSP surface finish for low cost solution
4. Thin die / thin core for low profile
Reliability Level
• Moisture Sensitivity : JEDEC Level 3 (30°C / 60% RH, 192 hours)
• Temp. Cycle Test : -65 / +150°C, 1000 cycles
• Temp. Shock Test : -65 / +150°C, 5 min Shock, 300 cycles
• High Temperature Storage : 150°C, 1000 hours
• Low Temperature Storage : -25°C, 1000 hours
• Unbiased HAST : 130°C / 85% RH, 96hrs
• Temp. Humidity Test : 85°C / 85% RH, 1000hrs
  
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