A good package design can offer excellent electrical, thermal, reliability performance and mechanical behavior to meet the customers' requirements for thinner, smaller but more functions. Being composed of many experts from different fields, such as mechanical engineering, physics, chemistry and electronics, PTI's design center can assist customers to develop the optimum package under lead frame or substrate trace layouts, while incorporating competitive material cost and reliable processes.
Broad range of design tools
We provide package design services with the most advanced software and hardware to support more and more packaging challenges from various new applications.
- Cadence APD
- AutoCad mechanical
Complete design output
- Package outline drawing
- Wire bonding drawing
- Substrate or lead frame layout drawing