Thermal Characterization


Overview
PTI provide simulation and measurement services to overcome thermal issues as operating frequency, power densities become higher and higher. PTI offers thermal characterization services of IC packages in both natural and forced convection conditions. PTI provides services to conduct component-level and system-level thermal analyses.

Thermal characterization services include
• θJA (junction-to-ambient)
• θJC (junction-to-case)
• θJB (junction-to-board)
• ΨJT (junction-to-top)
• Thermal optimal design for packages

Detail S/W & H/W resource information include
• ANSYS
• Flotherm
• Wind Tunnel
• Thermal Chip Calibration Oven
• Still-air θJA measurement Chamber
• θJC Measurement System
  
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