Thin Wafer

Thin wafer technology is the key to stacking more chips into one specific package dimension. PTI provides the most advanced equipment and process technology to make the thinnest wafer come true and applicable to the package process. 20um chip thickness was achieved for engineering sample in 2007, which was used for 32 Flash chip stacking. And we believe 15 um chip thickness will be available for engineering samples in 2010.





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