Wire Bonding Technology (Ultra low loop and Overhang wire bonding)

Overhang wire bonding capability will influence the effectiveness of different chips' stacking sequence. More precise looping control is necessary for complicated wire loops for 3D stacking.

With the most advanced technology, we plan to achieve Ultra Low Loop (15um) in 2010 while Ultra Low loop (20um) was ready in 2008.



  
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