Package Stacking
 



PoP Pre-Stack Service
PoP (Package-on-Package) is designed for space savings, enhanced wafer thinning technology, excellent control on warpage and eliminated die cracks. This package can squeeze the space into applications requiring a thin form factor. PoP was originally applied to Digital Still Camera but was gradually used for intelligent mobile phones. Another popular application of PoP is designed for different functions packages stacking, such as CPU, controller, memory…etc. or just to increase memory density of DRAM modules and Flash memory.

In terms of PoP package assembly , PTI provide the PoP pre-stack solution to satisfy rapid customer demand in pre-stack service . From conventional TSOP stack ,VFBGA stack to TMV PoP stack , we provide specific solution and tool for various customer requirement to make pre-stack success


• Process Feature
• 2 Package Stack
• Package warpage simulation
• 0.4mm ball pitch handling
• FA analysis through EDX,SEM,Dye & ply test ,cross section.
• PoP Open-short circuit test
• Finish good automation visual inspection solution provided

 

  
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