Memory Cube Die Stacking


Application
High density memory with low power consumption and compact package size

 
Features
We offer memory cube die stacking up to 8 dice, have completed the process development for following critical process for die stacking of memory cube:
1. Thin die handling.
2. High accurate D2D stacking
3. Micro bump interconnection


PTI Capability
• TSV VL aspect ratio >3
• Thin die dicing, pick & place – Si thickness: 35 μm
• High accuracy COC stacking – Accuracy: +/-3 μm
• Micro bump joint – Bump size: 20 μm
• Narrow gap underfill – Min. gap: 15 μm

For more information, please contact PTI Sales Office

  
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