Lead-Free Bump

Bumping is replacing wire bonding as the connecting method to accommodate the growing number of components. Out of all the bumping types, lead-free bumping has the longest production history in flip chip technology. Lead-free bumps are spheres of solders, which are formed on contact pads of semiconductor devices and subsequently used in flip chip bonding.

Lead-Free Bump Solution

Lead-Free Bump Capability

• Bump Pitch 130~250 um.
• Min. UBM Size 70 μm.
• SnAg 1.8 wt% Lead- free Solder.
• Low Curing Temperature PI (~200 °C) for Memory Devices.
• High Curing Temperature PI (~375 °C) for Logic Devices.
• Optional Polyimide (PI) Coating.

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