Overview

System-in-Package( SiP ), is a package with a substrate base, housing one or more IC’s, multiple passives, and other surface mount devices. The use of advanced assembly techniques, such as wire bond and flip chip allows various IC wafer technologies and other components to be built into a small package outline, providing the most cost effective and reliable solutions. In addition, this package can be packaged either as a LGA or BGA to meet various for thermal & electrical requirement applications .