PTI's Milestone

Powertech Technology

25th Anniversary

As we reflect on our past, we will continue to strive for a better future.

2022

  • May--Selected as one of the "Top 2,000 Companies" by Commonwealth Magazine
  • Sep--Chairman D.K. Tsai Ranked by Harvard Business Review as Taiwan Top 100 Best-Performing CEOs for the Fourth Time
  • Sep--Again Awarded for Excellence in Corporate Social Responsibility by CommonWealth Magazine
  • Nov--Recognized as the OSH Excellent Manufacturer
  • Nov--Won six awards in the TCSA

2021

  • Aug--PTI Group honored with 2020 Linkedin Rising Star Award
  • Oct--PTI won the "TSAA Taiwan Sustainability Action Award" Silver Award
  • Nov--PTI honored with in total 6 awards from TCSA
  • Nov--PTI won BSI Sustainability Award
  • Nov--PTI honored with Awards for Excellent Trading Businesses
  • Dec--PTI received“Certification of ISO 37001-Anti-bribery management systems ”

2020

  • Aug--PTI was awarded “2020 Taiwan’s Excellence in Corporate Social Responsibility”
  • Sep--PTI won the "Excellent Business Entities of Northern Area " award
  • Sep--PTI Group won 2019 LinkedIn’s Transformation Award
  • Oct--PTI Group Chairman D.K. Tsai ranked the fifth of Taiwan’s 100 best-performing CEOs by Harvard Business Review
  • Oct--PTI Implements Corporate Sustainability with Actions and Won the 2020 SGS Prestigious Sustainability Awards.
  • Nov--2020 TCSA:PTI won 4 awards of the Year

2019

  • May--Received“Preferred Quality Supplier Award” and ”Good Partner Award” from key customer.
  • Nov--Received 2019 Annual Taiwan Institute for Sustainable Energy Top 50 Corporate Sustainability Report Platinumand Top 50 Corporate Sustainability.
  • Dec--Certified ISO5001Energy Management System

2018

  • Jan--Named Top 100 Global Technology Leader by Thomson Reuters.
  • Sep --Groundbreaking for Hsin Chu Science Park Plant III as the Fan-Out Panel-Level Packaging (FOPLP) facility.
  • Nov--Board of Directors appointed Mr. DK Tsai as Chief Strategy Officer and Mr. JY Hung as Chief Executive Officer.
  • Nov--Received 11thAnnual Taiwan Institute for Sustainable Energy Top 50 Corporate Sustainability Report Platinumand Top 50 Corporate Sustainability.

2017

  • Jan--Established Powertech Technology Japan Ltd.
  • Jan--Mutual agreement among Powertech Technology Inc. and Tsianghua Unigroup Co., Ltd., and Tibet TouZhanChaungXin Investment Co., Ltd. authorized to terminate share subscription agreement.
  • Jan--Became a member of Taiwan Alliance for Sustainable Supply and participate in Taiwan packaging and testing industry eco-cloud development program.
  • Apr--Contracted with Micron Inc to acquire its 39.6% holding of Tera Probe,Inc. shares bypublic tender offerand 100% Micron Akita Inc.operations.
  • Jun--Tera Probe,Inc. became a PTI subsidiary after completed acquisition of Tera Probe,Inc. with 59.44% consolidated holding.
  • Aug--Completed the acquisition of 100% Micron Akita Inc. and name changed to Powertech Technology Akita Inc.
  • Nov--Received 2017 Taiwan Top 50 Corporate Sustainability Report Golden Award in Electronic Information Category.

2016

  • Apr--Received 2015Golden Trade Award for 4thplace.
  • Nov--Received 2016 Taiwan Top 50 Corporate Sustainability Report Golden Award in Electronic Information Category.
  • Nov--Certified for ISO 27001 Data Security Management System.
  • Dec--Certified for SA8000 Social Responsibility Management System

2015

  • Apr--Became a member of Electronic Industry Citizenship Coalition (EICC).
  • May--Established Powertech Semiconductor (Xian) Co.,Ltd.
  • Oct--Signed strategic alliance agreement with Tsinghua Unigroupthrough private placement.

2014

  • Feb--Legal settlement reached with Tessera Inc. to early terminate productlicense agreement which help reducing future services costs.
  • Jul--Acquired100% shares of Nepes Pte. Ltd. Singapore and changedname to Powertech Technology (Singapore) Pte. Ltd.
  • Dec--Signed investment agreementswith Micron Inc. forprovidingpackageservices in Xian, China.
  • Dec--MergedMacrotech Technology Inc. and established Hsinchu Science Park branchon the site.

2013

  • Jul--Elpdia Memory Inc. acquired by Micron Technology Inc.and changed the trading entity to Micron Japan.
  • Sep--Received 2012 Golden Trade Award for 10thplace.
  • Nov--Grand Opening for plant3C, and relocated HQ to the new plant

2012

  • Feb--Acquired 44% of Greatek Electronics through public tender offer.
  • Apr--During re-election at the extraordinary shareholders' meeting, PTI formally become part of theGreatek Electronics' management.
  • Apr--Institutional director Shiren Investment Company sold more than 50% of company shares owned when it was elected director, so naturally dismissed as company director.
  • Aug--Purchased of company’s treasury stocks for the first time, with a capital reduction of NT$ 200 million, Paid in Capital reduced to NT$ 7,791,466,340.
  • Dec--For effective use of company resources and tax considerations, liquidated US subsidiary Powertech Technology USA Inc.

2011

  • May--New Plant in Hukuo started construction.
  • Aug--Surplus Capital Increase of NT$ 7,264,969,400.Paid-in Capital of NT$ 7,991,466,340.
  • Aug--Received the “Creating Employment Contribution Award” from the Executive Yuan.
  • Sep--Received the “2010 Golden Commerce Award” from the MOEA Bureau of Foreign Trade (BFT) for Being Sixth in Actual Import/Export.
  • Dec--Established Remuneration Committee.

2010

  • Mar--Formed subsidiary in the Hsinchu Science Park, Macrotech Technology Inc.
  • Mar--Established US subsidiary Powertech Technology (USA), Inc through overseas subsidiary Powertech Holding ( B.V.I.) Inc. to serve as overseas sales and service center.
  • Apr--Paid-in capital increased to NT$ 7,042,366,680 after conversion into common shares by convertible bonds.
  • Sep--Paid-in capital increased to NT$ 7,153,668,040after conversion into common shares by convertible bonds.
  • Sep--Received the “2009 Golden Commerce Award” from the MOEA Bureau of Foreign Trade (BFT) for Being Fifth in Actual Import/Export.
  • Sep--Received the “Outstanding Innovation Company Award” portion of the 18thIndustry Technology Development Award from the MOEA DOIT.
  • Dec--Paid-in capital increased to NT$ 7,264,969,400after conversion into common shares by convertible bonds.

2009

  • July--Surplus Capital Increase of NT$ 386 million, Paid-in Capital of NT$ 6.694 billion.
  • Aug--Received the “2008 Golden Commerce Award” from the MOEA Bureau of Foreign Trade (BFT) for Being Fifth in Actual Import/Export.--Formed overseas subsidiary Powertech Holding( B.V.I.) Inc.
  • Sep--Acquired Spansion Holdings (Singapore) Pte. Ltd.(name changed to PTI Technology (Singapore) Pte. Ltd.) through Powertech Holding(B.V.I.) Inc., and indirectly obtaining Spansion’s MCP packaging and testing plant in Suzhou, China. The China plant was renamed Powertech Technology (Suzhou) Ltd., and the Company formally entered China as a packaging and testing company.

2008

  • Jan--Hukuo Plant 2B completed for operation.March--Started to provide packaging services for Logic IC.
  • Jun--Received license from IBM for Metal Post Solder-Chip Connection (MPS-C2) technology. This is a key technology for fine-pitch Flip Chip packaging.
  • Aug--Surplus Capital Increase of NT$ 7.45 million, Paid-in Capital of NT$ 6.694 billion.
  • Aug--Formed joint venture, TeraPower Technology Inc, with Japanese company Tera Probe, Inc, with paid-in capital of NT$ 750 million, and our company holding 49% of the JV.
  • Sep--Received the “2007 Golden Commerce Award” from the MOEA Bureau of Foreign Trade (BFT) for Being Ninth in Actual Import/Export.
  • Nov--Received land from the Hukuo Industrial Park about 5,953 pings, for expansion of future operations.

2007

  • Feb--Started construction of Hukuo Plant 2B
  • Mar--Issued for the first time the private placement domestic unsecured convertible bonds, with amount issued of NT$ 3.412 billion.
  • July--Successful developed the wBGA DDP technology, providing the best DRAM stacking solution.
  • Aug--Surplus Capital Increase of NT$ 853 million, Paid-in Capital of NT$ 5.563 billion.
  • Aug--Monthly Revenue exceed NT$ 2 billionformally, packaged volume exceeding 100 millionchips.
  • Aug--Received the “2006 Golden Commerce Award” from the MOEA Bureau of Foreign Trade (BFT) for Being Tenth in Actual Import/Export.
  • Nov--Received the “Eight Industrial Elite Award” from the MOEA BFT.

2006

  • Jan--R&D Technology Center Established.--Headquarters (Plant 3) completed for use.
  • Jan--First time issuance of Global Depository Receipts (old shares), listed for trading on the Bourse de Luxembourg.
  • Aug--Surplus Capital Increase of NT$ 750 million, Paid-in Capital of NT$ 4.711 billion.
  • Aug--Received ISO/TS 16949:2002 Certification.Nov--Received land from the Hukuo Industrial Park about 1089 pings, for expansion of future operations.
  • Dec--Received the “2006 Industrial Innovation Outcome Commendation” from the Ministry of Economic Affairs Department of Industrial Technology (MOEA DOIT).

2005

  • Feb--Implemented Green Product (GP) Management System.
  • Mar--Received quality certification from IBM (uBGA).
  • Mar--Received quality certification from Sharp.
  • May--Received quality certification from Sony Green Partner.
  • Sep--Surplus Capital Increase of NT$ 625 million, Paid-in Capital of NT$ 4.005 billion.
  • Sep--Tera Probe, Inc., a joint venture formed in Japan with Elpida, Advantest and Kingston Technology Japan.
  • Dec--Use the “Purchase Method” for simplified merger of 100% owned company, Lijia Investment Ltd.
  • Dec--MCP packaging process into volume production.
  • Dec--Started production of MicroSD Card.--Received ISO 14001:2004 Environmental Management System Certification.

2004

  • Jan--WBGA packaging formally into volume production.
  • Apr--Received land from the Hukuo Industrial Park about 3000 pings, for expansion of future operations.
  • Apr--Received quality certification from Renesas.
  • July--DDR2 formally into volume production.
  • Sep--Cash Injection of NT$ 300 million, Surplus Capital Increase of NT$ 467.5 million, Paid-in Capital of NT$ 3.38 billion.
  • Sep--Received OHSAS 18001:1999 Occupational Health and Safety Management certification.
  • Sep--Started construction on Plant 3.
  • Oct--Received quality certification from Elpida.
  • Nov--Company Shares listed for trading on the Taiwan Stock Exchange.
  • Nov--Foundry grade testing formally into mass production.

2003

  • Jan--Received ISO 14001:1996 Environmental Management Systems Certification.
  • Mar--Received quality certification from Sony.
  • Apr--Company Shares listed for trading on Gretai Securities Market.
  • Apr--Company headquarters moved to Hukuo Plant in Hsinchu Industrial Park.
  • Apr--Received quality certification from ProMos.
  • May--Received quality certification from IBM.
  • Jul--Received quality certification from Hynix and received Hynix orders.
  • Jul--Formally received ProMos orders.Aug--Received ISO 9002:2000 Quality Management System Certification
  • Sep--Surplus Capital Increase of NT$ 149.371 million, Paid-in Capital of NT$ 2.6125 billion.
  • Dec--Received quality certification from Xanavi

2002

  • Jan--Received quality certification from Hitachi.
  • Mar--Received quality certification of testing and packaging from TOSHIBA.
  • Mar--Received TOSHIBA FLASH packaging and testing orders, provide turnkey services for TOSHIBA packaging and testing.
  • June-Passed quality certification from Sun Microsystems.
  • Sep--Cash Injection of NT$ 119 million, SurplusCapital Increase of NT$ 134.23 million, Paid-in Capital of NT$ 2.46 billion.
  • Sep--Purchased Hukuo Plant’s Land and Plant of FICTA.
  • Oct--Company Shares listed for trading as Emerging Stock of Gretai Securities Market.
  • Nov--Received quality certification from M-Systems and Sankyo.

2001

  • Jan--Become listed as bonded factory.
  • Apr--Received quality certification from Mitsubishi.
  • May--Received ISO 9002:1994 Quality Management System Certification (Packaging, Testing).
  • Aug--Surplus and Capital Reserve Capital Increase of NT$ 218 million, Paid-in Capital of NT$ 2.218 billion.

2000

  • Apr--Report prepared for the Taiwan Stock Exchange and GreTai Securities Market, started to receive guidance for listing on TSE and OTC.
  • Jun--PTI Hsinpu Plant completedand relocatedto new plant.
  • Oct--Purchase backend equipment from Powerchip's Chubei Branch and added packaging business. Then obtained Powerchip’s DRAM packaging orders and started to provide customers turnkey packaging and testing services.

1999

  • Jan--Mr. Duh Kung Tsai from the Kingston Group joined as Chairman.
  • May--Cashinjection of NT$ 800 million, Paid-in Capital of NT$ 2.0 billion.
  • Jun--Stage One of PTI Hsinpu Plant completed, rented to Powerchip’s Chubei Branch.
  • Aug--Construction started on Stage two of PTI Hsinpu Plant.
  • Aug--Received testing order from Toshiba for DRAM and SST for Flash.

1998

  • Feb--Received Securities and Futures Commission, Ministry of Finance approval for public offering.
  • Feb--Started construction for PTI’s Hsinpu Plant.
  • Mar--Cash Injection of NT$ 600 million, Paid-in Capital of NT$ 1.2 billion.
  • May--Passed ISO 9002 Quality Management System Certification (Testing).

1997

  • May--Powertech Technology Inc. established, with paid-in Capital of NT$ 600 million.
  • Aug--Received Powerchip’s DRAM and Macronix’s FLASH testing order and started memory IC testing services.