Promise Technology Integration

PTI is the world's leading provider of turnkey services for chip probing, packaging, and testing.

Wafer Level Packaging

Due to the market trend of semiconductor package miniaturization, a number of technologies are invented to achieve small form factor, with WLP being the most common package.

PTI offers comprehensive chip probing services for Memory and Logic devices. In addition to testing and WLBI service for mass production products, we also provide probing technology development, devices correlation, engineering, and special lots support.

Flip Chips

PTI offers FCBGA package with organic substrate has high electrical performance / pin counts characteristic compared to wire bond BGA package due to FCBGA use bumps for die / substrate interconnections instead of wires. For high thermal performance requirement, external heat spreader is attached on ...

Final Test

PTI offers comprehensive final test services for DRAM, NOR Flash, NAND Flash, MCP and Logic devices. In addition to testing and BI service for mass production products, we also provide testing and BI program development, plateform conversion, devices correlation, engineering, special lots support, t...

Wire Bond BGA

Modern memory devices have the characteristics of low profile, less power consumption, high density, and time to market. Our dedication provided us with solutions to reach all meet these specs and beyond.

Module Assembly

◆High speed/accuracy SMT and dispense process in Class 1K to 100K◆Real time production equipment, yield, WIP and Component level traceability◆Customized automation equipment support your complicated module assembly process◆LTS(Low temperature solder) and UV process support unique assembly requiremen...

System in Package

System-in-Package( SiP ), is a package with a substrate base, housing one or more IC’s, multiple passives, and other surface mount devices. The use of advanced assembly techniques, such as wire bond and flip chip allows various IC wafer technologies and other components to be built into a small pack...