2023.12.20
Powertech Technology Inc. cooperates with Winbond Electronics Corporation to jointly develop business of 2.5D (Chip on Wafer on Substrate)/3D packaging
On Dec. 20, 2023, Powertech Technology Inc. (PTI)(6239.TW), announced that they signed the letter of Intent with Winbond Electronics Corporation (WEC)(2344.TW) to jointly develop business of 2.5D (Chip on Wafer on Substrate)/3D advanced packaging.
With the vigorous development of artificial intelligence technology, the market demand for broadband and high-speed computing has increased rapidly, which has driven strong demand for advanced packaging and heterogeneous integration. As a leader in the industry, PTI is firmly determined to invest in and lead this technological wave. This strategic collaboration aims to meet the strong market demand for 2.5D (Chip on Wafer on Substrate)/3D advanced packaging and expect to exceed customer expectations.
PTI will provide this packaging services, including the services of 2.5D (Chip on Wafer on Substrate) /3D advanced packaging, bumping and TSV (Through Silicon Via) – via-reveal packaging. PTI will recommend its customers to use the silicon Interposer, DRAM and Flash provided by WEC to achieve heterogeneous integration and fulfill the market demand on service of highbandwidth and high performance computing.
WEC’s new Silicon-Interposer technology is a companion product in its development of the CUBE DRAM series, which not only achieves High Performance of AI Edge Computing, but also combines 2.5D and 3D Heterogeneous Integration Packaging Technology of PTI. This not only enhances high-bandwidth performance, but also reduces the power required for data transmission, thereby catering to the desire and demand for high-speed computing and low energy consumption in the AI era.
Through comprehensive upstream and downstream integration services, PTI and WEC will be able to provide more heterogeneous integration solutions for customers to promote the development of AI technology and lead the rapid and vigorous development of the AI edge computing.
About Powertech Technology Inc:
Powertech Technology Inc. (PTI), the world's leading OSAT, was founded in 1997. We serve the international customers with services including chip bumping, chip probing, IC assembly, final testing, burn in, and system level assembly. PTI expanded the production base to Japan to serve the local automotive electronics and IoT market. After that, PTI began the construction of the newest Fan Out Panel Level Package manufacturing facility in Hsinchu Science Park.
PTI has over 18,000 employees worldwide, and manufacturing facility located in Taiwan, China and Japan. PTI dedicates her efforts in developing advanced technologies, while carrying on as the world's leading memory packaging and testing solution provider. Through strategic alliances and resource integration, PTI group relentlessly marches onward in the semiconductor packaging and testing field.
With the vigorous development of artificial intelligence technology, the market demand for broadband and high-speed computing has increased rapidly, which has driven strong demand for advanced packaging and heterogeneous integration. As a leader in the industry, PTI is firmly determined to invest in and lead this technological wave. This strategic collaboration aims to meet the strong market demand for 2.5D (Chip on Wafer on Substrate)/3D advanced packaging and expect to exceed customer expectations.
PTI will provide this packaging services, including the services of 2.5D (Chip on Wafer on Substrate) /3D advanced packaging, bumping and TSV (Through Silicon Via) – via-reveal packaging. PTI will recommend its customers to use the silicon Interposer, DRAM and Flash provided by WEC to achieve heterogeneous integration and fulfill the market demand on service of highbandwidth and high performance computing.
WEC’s new Silicon-Interposer technology is a companion product in its development of the CUBE DRAM series, which not only achieves High Performance of AI Edge Computing, but also combines 2.5D and 3D Heterogeneous Integration Packaging Technology of PTI. This not only enhances high-bandwidth performance, but also reduces the power required for data transmission, thereby catering to the desire and demand for high-speed computing and low energy consumption in the AI era.
Through comprehensive upstream and downstream integration services, PTI and WEC will be able to provide more heterogeneous integration solutions for customers to promote the development of AI technology and lead the rapid and vigorous development of the AI edge computing.
About Powertech Technology Inc:
Powertech Technology Inc. (PTI), the world's leading OSAT, was founded in 1997. We serve the international customers with services including chip bumping, chip probing, IC assembly, final testing, burn in, and system level assembly. PTI expanded the production base to Japan to serve the local automotive electronics and IoT market. After that, PTI began the construction of the newest Fan Out Panel Level Package manufacturing facility in Hsinchu Science Park.
PTI has over 18,000 employees worldwide, and manufacturing facility located in Taiwan, China and Japan. PTI dedicates her efforts in developing advanced technologies, while carrying on as the world's leading memory packaging and testing solution provider. Through strategic alliances and resource integration, PTI group relentlessly marches onward in the semiconductor packaging and testing field.