TSOP (Thin smaller outline package) is a rectangular surface mount package with outer leads on its short and long side. PTI offers the TSOP package for various devices, such as ROM, NOR, SDRAM, DDR, NAND Flash.
- Leadframe base
- Standard / Green EMC molding material
- Paste/ Film tape/ DDAF/ FOW Die Attach Adhesive
- Alloy42/Copper Lead-Frame
- 0.18mm Lead Pitch
- 2~8 chips stack
- 2 package stacking
- Ultra low loop (35um)
- JEDEC trays/Tape and Reel services
Frequently used for RAM or Flash memory ICs due to their high pin count and small volume
QFN package services by utilizing plastic encapsulated leadframe base CSP with a lead pad on the bottom of the package to provide electrical interconnection. The body size of the QFN package has been reduced by 60% compared with the conventional QFP package. It provides good electrical performance by inner lead and short wire. The QFN package with small, lightweight, improved thermal and good electrical performance (but without re-designed lead frame) can ensure our customers gain cost-effective solutions.
- Low Profile < 0.9 mm
- Package Size 3x3mm to 9x9mm
- Lead Count 16 to 76 Lead
- Lead Pitch 0.4 / 0.5 mm
QFN package is suitable for applications in handheld devices such as cellular phones, PDAs, MP3s, game consoles and others portable products.