Wafer Level Packaging
Due to the market trend of semiconductor package miniaturization, a number of technologies are invented to achieve small form factor. WLCSP is one of the solutions , which provides low cost and high performance benefits. PTI can provide WLCSP service with RDL & PI/PBO passivation based on customer requirement. PTI also provide turnkey service from design , bumping , test and backend process to meet quick time to market demand.
- Fine Bump Pitch
- 1-2 layer RDL with multiple passivation layer available.
- RDL + Plated Bump available
Flash, Communication, PMIC, Memory Cards, Controller, RF, controller, handset audio.
- RDL min L/S : 8/8 um
- Ball Size diameter :125~250 um ( Pb- Free )
- Min Pitch: 200 um