IC Packaging

IC Packaging

Wafer Level Packaging


Due to the market trend of semiconductor package miniaturization, a number of technologies are invented to achieve small form factor. WLCSP is one of the solutions , which provides low cost and high performance benefits. PTI can provide WLCSP service with RDL & PI/PBO passivation based on customer requirement. PTI also provide turnkey service from design , bumping , test and backend process to meet quick time to market demand.


  • Fine Bump Pitch
  • 1-2 layer RDL with multiple passivation layer available.
  • RDL + Plated Bump available


Flash, Communication, PMIC, Memory Cards, Controller, RF, controller, handset audio.


  • RDL min L/S : 8/8 um
  • Ball Size diameter :125~250 um ( Pb- Free )
  • Min Pitch: 200 um