Technology at a Glance - 力成科技股份有限公司 Powertech Technology Inc.

简中 English

Innovative Technology

Technology at a Glance

Panel Level Fan Out Solution

CHIEFS^®

Chip First

CLIP^®

Chip Last

PiFO^®

Chip Middle

BF2O^®

Bump Free

Advanced Packaging

^TSV

^Bumping

^{Flip Chip}

^AiP

Others

Panel Level Fan Out

Bumping

TSV Solution

Flip Chip

Antenna in Package