PTI is the world's leading provider of turnkey services for chip probing, packaging, and testing.
Due to the market trend of semiconductor package miniaturization, a number of technologies are invented to achieve small form factor, with WLP being the most common package.
PTI offers comprehensive chip probing services for Memory and Logic devices. In addition to testing and WLBI service for mass production products, we also provide probing technology development, devices correlation, engineering, and special lots support.
PTI offers FCBGA package with organic substrate that has high electrical performance
PTI offers comprehensive final test services for DRAM, NOR Flash, NAND Flash, MCP and Logic devices. In addition to testing and BI service for mass production products, we also provide testing and BI program development, plateform conversion, devices correlation, engineering, special lots support, t...
Modern memory devices have the characteristics of low profile, less power consumption, high density, and time to market. Our dedication provided us with solutions to reach all meet these specs and beyond.
Being one of the most robust packaging option, we maintain a comprehensive portfolio of leadframe packages like QFN, TSOP, and others to address the diverse end markets.
The module level assembly involves High speed/accuracy SMT and dispense process from class 1K to class 100K
Our definition of the SiP is the package level integration of at least two ICs with dissimilar functions, accompanied by other sophisticated technologies like compartmental EMI shielding and high density SMT.
PTI is a global leading provider of turnkey services for chip probing, packaging, and testing.
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