先进技术
Flip Chip
Flip chip is a process to replace wire bonding, chip directly mount to a substrate or carrier through conductive bumps by IR reflow or thermal comparison bond. The conductive bumps are made by lead free solder bump or Cu pillar bump on chip pad normally. Flip chip bonding have some advantages over other interconnection processes. Flip chip bonding provide higher I/O count, short inter-connection paths, smaller form factor, high speed electrical performance.
Advanced Flip Chip Packaging Technology
- High speed up to 16Gb/s FC package in production
- BT, ETS, Mold substrate(C2iM) in production
- Hybrid package Wire bond + Flip chip (8D memory + Controller) in production
- High thermal dissipation over mold(3 Watt)/ lidded package in production
- BoL, BoP for Over mold & lidded packages in production
- High reliability performance (automotive) flip chip package in production
- Ultra small form factor hybrid package (3 WB dies on FC, MUF) in production
